F abrication and application of a full wafer size micro / nanostencil for multiple length - scale surface patterning

A tool and method for flexible and rapid surface patterning technique beyond lithography based on high-resolution shadow mask method, or nanostencil, is presented. This new type of miniaturized shadow mask is fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. Thereby apertures in a 100–500 nm thick low-stress silicon nitride membrane in the size range from , 100 nm to . 100 mm were made. The stencil device is mechanically fixed on the surface and used as miniature shadow mask during deposition of metal layers. Using this method, aluminum microand nanostructures as small as 100 nm in width were patterned. The deposited microand nano-scale structures were used as etch mask and transferred into a sub-layer (in our case silicon nitride) by dry plasma etching. High-resolution shadow masking can be used to create micro /nanoscale patterns on arbitrary substrates including mechanically fragile or chemically active surfaces.  2003 Elsevier Science B.V. All rights reserved.